David Hanak Kulesi sihloko esifingqiwe, sikhumbula izehlakalo ezibaluleke kakhulu ezenzeka emhlabeni we-IT ezinsukwini eziyi-7 ezedlule.
Kungaba njalo okuthakaselayo
Amaya Toman Isixhumi se-USB 4 kufanele ekugcineni sibe isixhumi esikhulu "sendawo yonke".
I-Konektor USB eminyakeni yamuva, uye wanda umsebenzi owenziwayo wokuthi kwenziwa kanjani bayanda yakhe amakhono. Kusukela enhlosweni yasekuqaleni yokuxhuma ama-peripherals, ngokuthumela amafayela, ukushaja amadivaysi axhunyiwe, ukuya ekhonweni lokudlulisa isignali yomsindo nokubukwayo ngekhwalithi enhle kakhulu. Kodwa-ke, ngenxa yezinketho ezibanzi kakhulu, kwakukhona uhlobo lokuhlukaniswa kwalo lonke izinga, futhi lokhu kufanele kuxazululwe kakade. Isizukulwane se-4 lesi sixhumi. Isizukulwane sesine se-USB kufanele sifike emakethe namanje kulo nyaka futhi ulwazi lokuqala olusemthethweni lubonisa ukuthi kuzoba mayelana kakhulu nekhono isixhumi.
Isizukulwane esisha kufanele sinikele kabili ukudluliswa isivinini uma kuqhathaniswa ne-USB 3 (kufika ku-40 Gbps, efanayo ne-TB3), ngo-2021 kufanele kube khona ukuhlanganiswa ejwayelekile BonisaPort 2.0 ku-USB 4. Lokhu kungenza isizukulwane se-USB 4 sibe isixhumi esisebenza ngezindlela eziningi futhi esikwaziyo ukwedlula isizukulwane samanje nokuphindaphinda kokuqala kwesikhathi esizayo. Ekucushweni kwayo okuphezulu, i-USB 4 izosekela ukudluliswa kwevidiyo kokulungiswa 8K/60Hz kanye no-16K, sibonga ukusetshenziswa kwezinga le-DP 2.0. Isixhumi esisha se-USB sidonsa cishe konke ukusebenza kwalokho (ngokuqhathaniswa) okuvame ukutholakala namuhla I-Thunderbolt 3, okuze kube muva nje inikezwe ilayisense ku-Intel, futhi esebenzise isixhumi se-USB-C, esisabalele kakhulu namuhla. Kodwa-ke, ukwanda kobunzima besixhumi esisha kuzoletha izinkinga ngokuhlukahluka kwaso okuningi, okuzovela ngokuqinisekile. "Kuphelele"Isixhumi se-USB 4 ngeke sijwayeleke ngokuphelele futhi eminye yemisebenzi yaso izovela kumadivayisi ahlukahlukene mpofu, ukuguqulwa. Lokhu kuzodida futhi kube nzima kukhasimende lokugcina - isimo esicishe sifane kakhulu sesivele senzeka endimeni ye-USB-C/TB3. Ngethemba ukuthi abakhiqizi bazobhekana nayo kangcono kunalokho obekuyikho kuze kube manje.
Igalari yezithombe
I-AMD isebenza ne-Samsung kuma-SoCs eselula anamandla kakhulu
Njengamanje, amaphrosesa avela kwa-Samsung ayinhlekisa kwabaningi, kodwa lokho kungase kube ukuphela maduzane. Le nkampani yamemezela cishe unyaka odlule amasu ukubambisana s AMD, okufanele iphume kuyo okusha umfanekiso iprosesa kumadivayisi eselula. Lokhu kuzosetshenziswa ngabakwaSamsung kuma-Exynos SoCs ayo. Manje abokuqala bavele kuwebhusayithi waphunyuka izilinganiso, okusikisela ukuthi kungase kubukeke kanjani. AbakwaSamsung, kanye ne-AMD, bahlose ukwehlisa i-Apple esihlalweni sobukhosi sokusebenza. Izilinganiso eziputshuziwe azikhombisi ukuthi bazophumelela yini, kodwa zinganikeza inkomba yokuthi bazokwenza kanjani uma besebenza.
- I-GFXBench Manhattan 3.1: Ama-181.8 ozimele ngomzuzwana
- I-GFXBench Aztec (Ejwayelekile): Ama-138.25 ozimele ngomzuzwana
- I-GFXBench Aztec (Phezulu): Ama-58 ozimele ngomzuzwana
Ukwengeza umongo, ngezansi kunemiphumela etholwe kulawa mabhentshimakhi yi-Samsung Galaxy S20 Ultra 5G nge-processor. Snapdragon 865 kanye nama-GPU Adreno 650:
- I-GFXBench Manhattan 3.1: Ama-63.2 ozimele ngomzuzwana
- I-GFXBench Aztec (Ejwayelekile): Ama-51.8 ozimele ngomzuzwana
- I-GFXBench Aztec (Phezulu): Ama-19.9 ozimele ngomzuzwana
Ngakho-ke, uma ulwazi olungenhla lusekelwe eqinisweni, i-Samsung ingase ibe nento enkulu ezandleni zayo ESO, lapho (hhayi kuphela) i-Apple esula amehlo ayo. Ama-SoC okuqala adalwe ngesisekelo salokhu kubambisana kufanele afinyelele kuma-smartphones avame ukutholakala ngonyaka ozayo maduze nje.
Imininingwane yembangi eqondile i-SoC Apple A14 iputshuke ku-inthanethi
Ulwazi okufanele luchaze ukucaciswa kwe-SoC ephezulu ezayo yamadivayisi eselula - i-Qualcomm - isifinyelele kuwebhu. Snapdragon 875. Kuzoba ngeyokuqala ngqa i-Snapdragon ukukhiqizwa 5nm inqubo yokukhiqiza futhi ngonyaka ozayo (lapho izokwethulwa) izoba yimbangi enkulu ye-SoC I-Apple A14. Ngokusho kolwazi olushicilelwe, iphrosesa entsha kufanele iqukathe CPU Kryo 685, esekelwe ezinhlamvini ARM cortex v8, kanye ne-accelerator yezithombe Adreno 660, Adreno 665 VPU (Iyunithi Yokucubungula Ividiyo) kanye ne-Adreno 1095 DPU (Iyunithi Yokucubungula Isibonisi). Ngokungeziwe kulezi zici zekhompuyutha, i-Snapdragon entsha izophinde ithole ukuthuthukiswa emkhakheni wezokuphepha kanye nephrosesa entsha yokucubungula izithombe namavidiyo. I-chip entsha izofika nokusekelwa kwesizukulwane esisha sezinkumbulo ezisebenzayo I-LPDDR5 futhi vele kuzoba khona ukusekelwa (khona-ke mhlawumbe kutholakala okwengeziwe) 5G inethiwekhi kuwo womabili amabhendi amakhulu. Ekuqaleni, le SoC bekufanele ibone ukukhanya kosuku ekupheleni kwalo nyaka, kodwa ngenxa yezenzakalo zamanje, ukuqala kokuthengisa kuhlehliswe ngezinyanga ezimbalwa.
IMicrosoft yethule imikhiqizo emisha yeSurface yalo nyaka
Namuhla, iMicrosoft yethule izibuyekezo kweminye yemikhiqizo yayo emugqeni womkhiqizo surface. Ngokuqondile, iyintsha surface Book 3, surface Go 2 kanye nezinsiza ezikhethiwe. Ithebhulethi surface Go 2 ithole ukuklanywa kabusha okuphelele, manje isinesibonisi sesimanje esinamafreyimu amancane nokulungiswa okuqinile (220 ppi), amaphrosesa amasha we-5W avela ku-Intel ngokusekelwe ekwakhiweni kwezakhiwo. Amber Lake, siphinde sithole imakrofoni ephindwe kabili, ikhamera engu-8 MPx eyinhloko kanye nekhamera yangaphambili engu-5 MPx kanye nokulungiselelwa okufanayo kwememori (isisekelo esingu-64 GB esinokukhethwa kukho kokunwetshwa okungu-128 GB). Ukucushwa ngokusekelwa kwe-LTE kuyindaba eyiqiniso. surface Book 3 azizange zibe nezinguquko ezinkulu, zenzeke ikakhulukazi ngaphakathi emshinini. Amaprosesa amasha ayatholakala Intel Core 10th generation, kufika ku-32 GB we-RAM kanye namakhadi ezithombe anikezelwe amasha avela nVidia (kuze kube nokwenzeka ukucushwa nge professional nVidia Quadro GPU). I-interface yokushaja nayo ithole izinguquko, kodwa isixhumi se-Thunderbolt 3 asikatholakali.
Igalari yezithombe
Ngaphezu kwethebhulethi nelaptop, iMicrosoft iphinde yethula ama-headphone amasha surface Ama-headphone 2, elandela isizukulwane sokuqala kusukela ngo-2018. Lo modeli kufanele ube nekhwalithi yomsindo ethuthukisiwe nempilo yebhethri, idizayini entsha ye-earcup nezinketho zombala ezintsha. Labo abathanda ama-headphone amancane bazobe sebetholakala surface Okufakwa ezindlebeni, okuyizinto ezithathwa yiMicrosoft kuma-earbud angenawaya ngokuphelele. Okokugcina, iMicrosoft ibuye yavuselela yayo surface Nokho, 2, enwebise ukuxhumana kwayo. Yonke le mikhiqizo engenhla izoqala ukudayiswa ngoMeyi.
I-AMD yethule (ochwepheshe) amaphrosesa ezincwadi zokubhalela
Njengoba i-AMD isivele kukhulunywa ngayo kakhulu namuhla, inkampani inqume ukusizakala futhi yamemezela entsha “professional"umugqa iselula amaprosesa. Lawa ama-chips ancike kakhulu noma ngaphansi ngokususelwe kuma-chips wabathengi ajwayelekile esizukulwane sesine inkampani eyethule emasontweni ama-4 abuyile. Yabo ngoba kodwa-ke, okuhlukile kuyehluka ezicini ezimbalwa, ikakhulukazi enanini lama-cores asebenzayo, ubukhulu benqolobane futhi ngaphezu kwalokho kunikeza ezinye "professional” imisebenzi namasethi eziyalezo atholakala kuma-CPU “abathengi” avamile abanjalo. Lokhu kuhilela inqubo enemininingwane isitifiketi kanye nokusekelwa kwehadiwe. Lawa ma-chips enzelwe ukuthunyelwa okukhulu ngaphakathi Ibhizinisi, ibhizinisi kanye neminye imikhakha efanayo lapho kuthengwa khona ngobuningi namadivayisi adinga izinga elihlukile lokusekelwa kunama-PC/amakhompyutha aphathekayo avamile. Amaphrosesa afaka phakathi imisebenzi yokuphepha ethuthukisiwe noma yokuxilonga efana ne-AMD Memory Guard.
Igalari yezithombe
Ngokuqondene namaphrosesa ngokwawo, i-AMD okwamanje inikeza amamodeli amathathu - I-Ryzen 3 Pro 4450U enamacores angu-4/8, 2,5/3,7 GHz, 4 MB L3 cache kanye ne-iGPU Vega 5. Okuhlukile okuphakathi I-Ryzen 5 Pro 4650U enamacores angu-6/12, 2,1/4,0 GHz frequency, 8 MB L3 cache kanye ne-iGPU Vega 6. Imodeli ephezulu ke I-Ryzen 7 Pro 4750U enama-cores angu-8/16, 1,7/4,1 GHz, i-cache engu-8 MB L3 efanayo kanye ne-iGPU Vega 7. Kuzo zonke izimo, iyonga 15 W ama-chips.
Ngokusho kwe-AMD, lezi zindaba zifinyelela ku-o 30% enamandla ngaphezulu ku-monofilament kuze kufike ku-o 132% enamandla ngaphezulu emisebenzini enemicu eminingi. Ukusebenza kwezithombe kukhuphuke ngengxenye phakathi kwezizukulwane 13%. Uma kubhekwa ukusebenza kwama-chips amasha e-AMD, kungaba kuhle uma evela kuma-MacBooks. Kodwa kunalokho nje ukucabanga okunikufisa, uma kungeyona indaba yangempela. Lokhu kuyihlazo elikhulu, njengoba i-Intel njengamanje idlala i-fiddle yesibili.
